The project of "Chip localization and industrialization of high-performance wafer ceramic components" successfully passed the evaluation of scientific and technological achievements

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On September 13, 2023, Guangdong Electronic Information Industry Association organized and presided over the evaluation meeting of scientific and technological achievements of the "Chip type and Industrialization of high-performance wafer ceramic components" project completed by Guangdong Nanfang Hongming Electronic Technology Co., LTD。



Conference site


The meeting was chaired by Yang Junyi, deputy Secretary-General of the Association. The evaluation committee of the results was composed of experts from Guangdong University of Technology, South China University of Technology, Dongguan Electronic Information Industry Association, South China Normal University, Guangdong Vocational College of Innovation and Technology, Dongguan University of Technology, Guangdong Provincial Bureau of Small and Medium Enterprises, etc。Also present at the meeting were Li Alun, Vice minister of Member Service Department, Wu Yaji, senior director of Member Service Department, Zhao Junbin, general manager of Guangdong Nanfang Hongming Electronic Technology Co., LTD., and other enterprise project personnel。



Site inspection


Project of "Chip and industrialization of high performance wafer ceramic components",The chip technology of wafer ceramic capacitors, varistors and thermistors was first developed.Wafer type wafer safety ceramic capacitors meet both Y1 and Y2 safety requirements;Wafer wafer safety ceramic capacitors, high voltage ceramic capacitors, varistors and thermistors meet the needs of digital intelligent terminal products in miniaturization, thinness, modularization and integration。The evaluation committee believes that the project results have reached the domestic leading and international advanced level。



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